Solder Paste
Electroloy's lead-free solder paste provides manufacturers with the benefits of using the same solder paste on a variety of PCB boards under a variety of printing, placement and reflow conditions.
Our solder paste is produced in a rigorous process and controlled environment and is a very reliable, high quality solder paste.
We offer solder pastes in the low to medium temperature range. These solder pastes come in different types and particle sizes. With Electroloy solder paste, we will provide you with excellent technical support.
| Alloy number |
Solder paste type |
Alloy composition |
feature |
| LF-302P |
Lead-free disposable
EMCCO#233 |
Sn42 / Bi58 |
Probe-testable residue, excellent collapse resistance, excellent adhesion performance and printable time, extended print down time, bright, colorless residue. |
| LF-307P |
Lead-free and halogen-free
EMCO#265HF |
Sn96.5 / Ag3.0 / Cu0.5 |
Probe-testable residue provides enhanced activity for PCB board and component robustness, outstanding collapse resistance, outstanding adhesion performance and printable time, extended "printing period" interval, bright, colorless Residue, no halogen. |
Lead-free disposable
EMCO#515 |
Sn96.5 / Ag3.0 / Cu0.5 |
Excellent printing function, loose reflow, reduced soldering of beads, anti-weld surface formulation, excellent printing in the hole. |
| LF-315P |
Lead-free disposable
EMCCO#265HF |
Sn99 / Ag0.3 / Cu0.7 |
Probe-testable residue provides enhanced activity for PCB board and component robustness, outstanding collapse resistance, outstanding adhesion performance and printable time, extended "printing period" interval, bright, colorless Residue, no halogen. |
Lead-free disposable
EMCO#515 |
Sn99 / Ag0.3 / Cu0.7 |
Excellent printing function, loose reflow, reduced soldering of beads, anti-weld surface formulation, excellent printing in the hole. |
| SN100CP |
Lead-free solder paste EMCO#255 |
SN100C |
Low residue, excellent through-hole penetration, reduced copper corrosion, reduced damage to stainless steel and tin furnace, close to eutectic point |
EMCO #233-302P
Electroloy EMCO #233-302P lead-free low temperature solder paste is a specially designed rosin solder paste for lead-free soldering operations. This solder paste provides excellent repeatability and consistency, as well as exceptional wetting ability in low temperature applications.
feature:
- Probe testable residue
- According to IPC J-STD-004 standard ROL1
- Excellent resistance to collapse
- Excellent adhesion performance and printable time
- Extended print break time
- Bright, colorless residue
|
|
| Test items |
characteristic |
| Viscosity |
150,000 ± 30,000 cp |
| Flux activity (according to IPC J-STD-004) |
ROL1 |
| Copper plate corrosion test |
qualified |
| Flux content |
9.5 ± 0.5% |
| Wettability test |
qualified |
| Tin bead test |
qualified |
| Typical viscosity (gf) |
30.6 |
| Collapse test |
qualified |
| Surface insulation resistance (typical), 168 hours (Ω) |
Qualified (≥1 X 10 10 Ω) |
EMCO #265HF-307P
Electroloy EMCO #265HF-307P No-Clean Solder Paste is a rosin-based solder paste with a wide print operating range and exceptionally long downtime and printable period. Its soft, non-stick residue improves the reliability of the in-line test and reduces the frequency of cleaning the probe.
feature:
- Probe testable residue
- According to IPC J-STD-004 standard ROL0
- Provides enhanced activity for the robustness of PCB boards and components
- Outstanding resistance to collapse
- Outstanding adhesion performance and printable time
- Extended "printing period" interval
- Bright, colorless residue
- Halogen free
|
|
| Test items |
characteristic |
| Viscosity |
160,000 ± 30,000 cp |
| Flux activity (according to IPC J-STD-004) |
ROL0 |
| Copper plate corrosion test |
qualified |
| Flux content |
11.0 ± 0.5% |
| Wetting test |
qualified |
| Tin bead test |
qualified |
| Collapse test |
qualified |
| Surface insulation resistance (typical), 168 hours (Ω) |
Qualified (≥1 X 10 9 Ω) |
EMCO #515-307P
Electroloy EMCO #515-307P Disposable Solder Paste is designed for use in lead-free soldering. It uses high shear resistance and provides excellent printability. This flux can withstand higher preheat temperatures and does not discolor. EMCO #515-307 is manufactured for high speed printing operations. EMCO #515-307 provides excellent wetting and soldering in most boards to include OSPs, reducing solder ball formation and solder balls.
feature:
- Excellent printing capabilities - for ultra-fine pitch soldering operations
- Loose reflow - increase production process
- Reduce tin beads - minimize rework
- Anti-welding surface formula - in accordance with IPC 7095 Voids Performance classification III
- Excellent printing in the hole - printing, dispensing SMT applications
|
|
| Test entry |
characteristic |
| Viscosity |
160,000 ± 30,000 cp |
| Flux activity (according to IPC J-STD-004) |
ROL0 |
| Copper plate corrosion test |
qualified |
| Flux content |
11.0 ± 0.5% |
| Diffusion test |
qualified |
| Tin bead test |
qualified |
| Flux residue adhesion test |
qualified |
| Collapse test |
Qualified (10 minutes @150 °C)
qualified (0.2 mm bridgeless spacing) |
| Surface insulation resistance (typical), 168 hours @85°C / 85%RH (Ω) |
Qualified (≥1 X 10 10 Ω) |
EMCO #265HF-315P
Electroloy EMCO #265HF-315P No-Clean Solder Paste is a rosin-based solder paste with a wide print operating range and exceptionally long downtime and printable period. Its soft, non-stick residue improves the reliability of the in-line test and reduces the frequency of cleaning the probe.
feature:
- Probe testable residue
- According to IPC J-STD-004 standard ROL0
- Provides enhanced activity for the robustness of PCB boards and components
- Outstanding resistance to collapse
- Outstanding adhesion performance and printable time
- Extended "printing period" interval
- Bright, colorless residue
- Halogen free
|
|
| Test items |
characteristic |
| Viscosity |
160,000 ± 30,000 cp |
| Flux activity (according to IPC J-STD-004) |
ROL0 |
| Copper plate corrosion test |
qualified |
| Flux content |
11.0 ± 0.5% |
| Wettability test |
qualified |
| Tin bead test |
qualified |
| Collapse test |
qualified |
| Surface insulation resistance (typical), 168 hours @85°C / 85%RH (Ω) |
Qualified (≥1 X 10 9 Ω) |
EMCO #515-315P
Electroloy EMCO #515-315P Disposable Solder Paste is designed for use in lead-free soldering. It uses high shear resistance and provides excellent printability. This flux can withstand higher preheat temperatures and does not discolor. EMCO #515-315 is manufactured for high speed printing operations. EMCO #515-315 provides excellent wetting and soldering in most boards to include OSPs, reducing solder ball formation and solder balls.
feature:
- Excellent printing capabilities - for ultra-fine pitch soldering operations
- Loose reflow - increase production process
- Reduce tin beads - minimize rework
- Anti-welding surface formula - in accordance with IPC 7095 Voids Performance classification III
- Excellent printing in the hole - printing, dispensing SMT applications
|
|
| Test items |
characteristic |
| Viscosity |
160,000 ± 30,000 cp |
| Flux activity (according to IPC J-STD-004) |
ROL0 |
| Copper plate corrosion test |
qualified |
| Flux content |
11.0 ± 0.5% |
| Wettability test |
qualified |
| Tin bead test |
qualified |
| Collapse test |
Qualified (10 minutes @ 150 °C)
qualified (0.2 mm bridgeless spacing) |
| Surface insulation resistance (typical), 168 hours @ 85°C / 85% RH (Ω) |
Qualified (≥1 X 10 10 Ω) |
EMCO#255-SN100CP
Electroloy EMCO#255-SN100CP No-Clean Solder Paste is a rosin-based solder paste with alloying elements containing tin, copper, nickel and niobium. The SN100C has a number of excellent welding qualities. In the international electronics industry, this alloy has established itself as one of the most popular lead-free metals. The addition of nickel to the tin-copper eutectic, which has been patented, provides the following advantages:
feature:
- Low cost lead-free alloy
- Low residue
- Bright and smooth welding interface, no cracks
- Excellent through hole penetration
- Reduce copper corrosion
- Reduce damage to stainless steel and tin furnace
- Close to eutectic point
- Easy to maintain alloy composition
|
|
| Test items |
characteristic |
| Viscosity |
160 ± 30 Pa.s |
| Flux activity (according to IPC J-STD-004) |
ROM1 |
| Copper plate corrosion test |
qualified |
| Flux content |
12.0 ± 0.5% |
| Diffusion test |
>82.0% |
| Tin bead test |
qualified |
| Collapse test |
Qualified (0.3mm) |
| Surface insulation resistance (typical), 168 hours @ 85°C / 85% RH (Ω) |
(≥1 X 10 9 Ω) |